Strict quality inspection is a key part of the CAX quality control system.
CAX has built an effective supply chain management system based on more than 10 years of distribution experience. We currently use a comprehensive supplier classification system to manage more than 5,000 suppliers, and we re-audit them quarterly to keep our database up to date.
Electrical Test
Test standard: “Test Methods for Semiconductor Discrete Devices” GJB 128A-1997Description:According to the electrical characteristics of the component specifications related to the requirements of the use of se...
DPA Destructive Physical Analysis
Inspection standard: GJB 4027A-2006 &MIL-STD-883K-2017Description:The main purpose is to utilize the instrument to corrode the package on the surface of the chip to check whether there is a wafer inside, the si...
Ambient Temperature Test
Description:1.ambient temperature test, simulating various types of extreme environments have a lot of impact on the product, such as reliability, oxidation, chemical changes, thermal diffusion, electromigratio...
Ultrasound Scan
Inspection Standards:IPC/JEDEC J-STD-035 Acoustic Microscopy Inspection Methods for Non-Hermetically Sealed Packaged Components, IPC/JEDEC J-STD-020 Moisture/Solder Rebond Sensitivity Classification of Non-Herm...
X-ray Test
Testing standard: GJB 360B-2009Description: For the chip can not be detected directly by the appearance of the location, the use of X-Ray penetration of different densities of different changes in the intensity...
External Visual Inspection
Test Standard: GJB548B-2005 & AS6081DESCRIPTION: Appearance testing means confirming the number of chips received, inner packaging, humidity indication, desiccant requirement and proper outer packaging. Next, i...
