Inspection standard: GJB 4027A-2006 &MIL-STD-883K-2017

Description:

The main purpose is to utilize the instrument to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, the wafer code, which can determine the authenticity of the chip.

Applications:

verification of chip authenticity and failure analysis, etc.