Strict quality inspection is key approach for CAX quality control system.
CAX has built up an effective supply chain managment system from our distributing experience for more than 10 years. Currently, we have a large supplier classfication system to manage more than 5,000 suppliers. We will reaudit all the suppliers quarterly and update our database.
Electrical Test
Test standard: “Test Methods for Semiconductor Discrete Devices” GJB 128A-1997Description:According to the electrical characteristics of the component specifications related to the requirements of the use of se...
DPA Destructive Physical Analysis
Inspection standard: GJB 4027A-2006 &MIL-STD-883K-2017Description:The main purpose is to utilize the instrument to corrode the package on the surface of the chip to check whether there is a wafer inside, the si...
Ambient Temperature Test
Description:1.ambient temperature test, simulating various types of extreme environments have a lot of impact on the product, such as reliability, oxidation, chemical changes, thermal diffusion, electromigratio...
Ultrasound Scan
Inspection Standards:IPC/JEDEC J-STD-035 Acoustic Microscopy Inspection Methods for Non-Hermetically Sealed Packaged Components, IPC/JEDEC J-STD-020 Moisture/Solder Rebond Sensitivity Classification of Non-Herm...
X-ray Test
Testing standard: GJB 360B-2009Description: For the chip can not be detected directly by the appearance of the location, the use of X-Ray penetration of different densities of different changes in the intensity...
External Visual Inspection
Test Standard: GJB548B-2005 & AS6081DESCRIPTION: Appearance testing means confirming the number of chips received, inner packaging, humidity indication, desiccant requirement and proper outer packaging. Next, i...
